| HIGH POWER LASER DIODES AND DIODE-BASED LASERS - 2003 EDITION |
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Background to the Report
High power laser
diodes (HPLD), i.e. laser diodes with an optical power of > 100 mW,
already play an important role in communications,
as pump sources for fiber amplifiers. In other application areas,
in printing & imaging, material processing, medical therapy, and
measurement & analysis, HPLD are used increasingly.
HPLD markets comprise a wide range
of products:
- HPLD of various wavelengths and mode characteristics
- Single stripe HPLD
- HPLD bars
- Surface emitting HPLD
- Fiber-coupled HPLD
- Diode-pumped solid state lasers (DPS): rod and disk lasers, fiber lasers
- Optically pumped semiconductor lasers (OPSL)
- Diode Lasers (DL)
The report evaluates the
present
and future applications and markets of these products.
The market forecast is based on
- an in-depth analysis of the technologies of HPLD, DPS, and DL. The impact of various scenarios regarding the development of DPS, fiber lasers, and surface emitting HPLD / OPSL is discussed in detail.
- an in-depth analysis of the end user markets. All market forecasts are done "bottom to top", i.e. each single market segment is analyzed, and the contributions to the HPLD market are added up.
- a discussion of HPLD production volumes and price / Watt.
Table of Contents of the Report
1. Market Overview
1.1
Market analysis and forecast for DPS
1.2
Market analysis and forecast for DL
1.3 Market analysis and forecast for HPLD in direct applications
1.4 Market analysis and forecast for HPLD
1.3 Market analysis and forecast for HPLD in direct applications
1.4 Market analysis and forecast for HPLD
2. Technology analysis forecast for HPLD
2.1
Overview
2.1 Laser diode bars
2.1 Laser diode bars
2.1.1
Power
2.1.2 Lifetime
2.1.3 Power density
2.1.4 Efficiency
2.1.5 Pulse characteristics: CW and QCW
2.1.6 Wavelengths of HPLD, new wavelengths
2.1.7 High brightness emitters
2.1.8 Phase-coupled arrays
2.1.2 Lifetime
2.1.3 Power density
2.1.4 Efficiency
2.1.5 Pulse characteristics: CW and QCW
2.1.6 Wavelengths of HPLD, new wavelengths
2.1.7 High brightness emitters
2.1.8 Phase-coupled arrays
2.2
Single stripe HPLD
2.3 VCSELs
2.4 NECSELs
2.5 Addressed laser diode arrays
2.3 VCSELs
2.4 NECSELs
2.5 Addressed laser diode arrays
3. Technology analysis and forecast for DL and DPS
3.1
Laser power and beam parameter product vs. laser type
3.1 DL
3.2 Fiber-coupled DL
3.3 Low power DPS
3.1 DL
3.2 Fiber-coupled DL
3.3 Low power DPS
3.3.1
Rod type DPS
3.3.2 Fiber laser
3.3.3 Disk laser
3.3.2 Fiber laser
3.3.3 Disk laser
3.4
High power DPS
3.4.1
Rod laser
3.4.2 Slab laser
3.4.3 Disk laser
3.4.4 Fiber laser
3.4.2 Slab laser
3.4.3 Disk laser
3.4.4 Fiber laser
3.5
Pulsed lasers: milli second pulses
3.6 Q-switched lasers - nano second pulses
3.7 Mode-locked lasers - pico and femto second pulses
3.8 Visible and UV lasers
3.9 Optically pumped semiconductor lasers
3.6 Q-switched lasers - nano second pulses
3.7 Mode-locked lasers - pico and femto second pulses
3.8 Visible and UV lasers
3.9 Optically pumped semiconductor lasers
4. Applications and laser specs required
4.1
Materials processing
4.5 Photofinishing and film exposure
4.6 Biomedical analysis
4.7 Measurement
4.8 Communications
4.9 Data storage and consumer electronics
4.10 Laser projectors and laser TV
4.1.1
Overview
4.1.2 Sheet metal cutting
4.1.3 Precision cutting
4.1.4 Drilling
4.1.5 Keyhole welding
4.1.6 Heat conduction welding
4.1.7 Spot welding
4.1.8 Transformation hardening
4.1.9 Melting, cladding
4.1.10 Brazing
4.1.11 Soldering
4.1.12 Plastics welding and cutting
4.1.13 Marking
4.1.14 Micro-processing
4.1.15 Other applications in materials processing
4.2 Medical therapy4.1.2 Sheet metal cutting
4.1.3 Precision cutting
4.1.4 Drilling
4.1.5 Keyhole welding
4.1.6 Heat conduction welding
4.1.7 Spot welding
4.1.8 Transformation hardening
4.1.9 Melting, cladding
4.1.10 Brazing
4.1.11 Soldering
4.1.12 Plastics welding and cutting
4.1.13 Marking
4.1.14 Micro-processing
4.1.15 Other applications in materials processing
4.2.1
Overview
4.2.2 Ophthalmology
4.2.3 Surgical applications in other medical specialties
4.2.3 Cosmetic applications
4.3 Printing and pre-press4.2.2 Ophthalmology
4.2.3 Surgical applications in other medical specialties
4.2.3 Cosmetic applications
4.3.1
Overview
4.3.2 Film exposure
4.3.2 Printing plate exposure
4.3.3 Direct to press
4.3.4 Other printing applications
4.4 Proofing and medical imaging4.3.2 Film exposure
4.3.2 Printing plate exposure
4.3.3 Direct to press
4.3.4 Other printing applications
4.5 Photofinishing and film exposure
4.6 Biomedical analysis
4.7 Measurement
4.8 Communications
4.9 Data storage and consumer electronics
4.10 Laser projectors and laser TV
5. HPLD parameters required by DPS and DL
5.1
Overview
5.2 HPLD parameters required by DPS
5.3 HPLD parameters required by DL
5.2 HPLD parameters required by DPS
5.3 HPLD parameters required by DL
6. HPLD prices and specs
6.1
Expected development of HPLD prices
6.2 Enabling prices for HPLD applications
6.2 Enabling prices for HPLD applications
7. Market analysis and forecast for DPS
7.1
Markets in materials processing
7.1.1
Marking
7.1.2 High power welding
7.1.3 High power cutting
7.1.4 Micro processing of semiconductors, electronic circuits & components, and PCBs
7.1.5 Microlithography (X-Ray generation)
7.1.6 Precision processing and other applications
7.1.2 High power welding
7.1.3 High power cutting
7.1.4 Micro processing of semiconductors, electronic circuits & components, and PCBs
7.1.5 Microlithography (X-Ray generation)
7.1.6 Precision processing and other applications
7.2
Markets in medical therapy
7.3 Markets in pre-press, imaging, and displays
7.4 Markets in biomedical analysis
7.6 Markets in measurement and R&D
7.6 Markets in other areas
7.3 Markets in pre-press, imaging, and displays
7.4 Markets in biomedical analysis
7.6 Markets in measurement and R&D
7.6 Markets in other areas
8. Market analysis and forecast for DL
8.1
Markets in material processing
8.3 Other markets
8.1.1
Overview
8.1.2 Soldering
8.1.3 Plastics welding
8.1.4 Metal welding and brazing
8.1.5 Surface hardening and cladding
8.1.6 Other applications
8.2 Markets in medicine8.1.2 Soldering
8.1.3 Plastics welding
8.1.4 Metal welding and brazing
8.1.5 Surface hardening and cladding
8.1.6 Other applications
8.3 Other markets
9. Market analysis and forecast for HPLD in direct applications
9.1
Communications
9.2 Printing and pre-press
9.3 Proofing and medical imaging
9.4 Fotofinishing
9.5 Medical therapy
9.6 Laser TV
9.7 Other applications
9.2 Printing and pre-press
9.3 Proofing and medical imaging
9.4 Fotofinishing
9.5 Medical therapy
9.6 Laser TV
9.7 Other applications
10. Market analysis and forecast for HPLD
10.1
Overview
10.2 HPLD for DPS pumping
10.5 Replacement market
10.2 HPLD for DPS pumping
10.2.1
Materials processing
10.2.2 Other application areas
10.3 Applications via DL10.2.2 Other application areas
10.3.1
Materials processing
10.3.2 Medicine
10.4 Applications for HPLD for direct use10.3.2 Medicine
10.5 Replacement market
11. Geographic market breakdown
12. Manufacturers and market shares
12.1
Manufacturers of HPLD
12.2 Manufacturers of DPS
12.3 Manufacturers of diode lasers
12.2 Manufacturers of DPS
12.3 Manufacturers of diode lasers
13. Company profiles
13.1
Europe
13.2 North America
13.3 Japan
11.5 Other countries
13.2 North America
13.3 Japan
11.5 Other countries